伟德综合体育b失效分析实验室AEC-Q技术团队，执行过大量的AEC-Q测试案例，积累了丰富的认证试验经验，可为您提供更专业、更可靠的AEC-Q认证试验服务。
测试周期：
3-4个月，提供全面的认证计划、测试等服务
测试项目：
| 序号 |
测试项目 |
缩写 |
样品数/批 |
批数 |
测试方法 |
| A组 加速环境应力试验 |
| A1 |
Preconditioning |
PC |
77 |
3 |
J-STD-020、 |
| JESD22-A113 |
| A2 |
Temperature-Humidity-Bias |
THB |
77 |
3 |
JESD22-A101 |
| Biased HAST |
HAST |
JESD22-A110 |
| A3 |
Autoclave |
AC |
77 |
3 |
JESD22-A102 |
| Unbiased HAST |
UHST |
JESD22-A118 |
| Temperature-Humidity (without Bias) |
TH |
JESD22-A101 |
| A4 |
Temperature Cycling |
TC |
77 |
3 |
JESD22-A104、Appendix 3 |
| A5 |
Power Temperature Cycling |
PTC |
45 |
1 |
JESD22-A105 |
| A6 |
High Temperature Storage Life |
HSTL |
45 |
1 |
JESD22-A103 |
| B组 加速寿命模拟试验 |
| B1 |
High Temperature Operating Life |
HTOL |
77 |
3 |
JESD22-A108 |
| B2 |
Early Life Failure Rate |
ELFR |
800 |
3 |
AEC-Q100-008 |
| B3 |
NVM Endurance, Data Retention, and Operational Life |
EDR |
77 |
3 |
AEC-Q100-005 |
| C组 封装完整性测试 |
| C1 |
Wire Bond Shear |
WBS |
最少5个器件中的30根键合线 |
AEC-Q100-001、AEC-Q003 |
| C2 |
Wire Bond Pull |
WBP |
MIL-STD883 method 2011、 |
| AEC-Q003 |
| C3 |
Solderability |
SD |
15 |
1 |
JESD22-B102或 J-STD-002D |
| C4 |
Physical Dimensions |
PD |
10 |
3 |
JESD22-B100、 JESD22-B108 |
| AEC-Q003 |
| C5 |
Solder Ball Shear |
SBS |
至少10个器件的5个键合球 |
3 |
AEC-Q100-010、 |
| AEC-Q003 |
| C6 |
Lead Integrity |
LI |
至少5个器件的10根引线 |
1 |
JESD22-B105 |
| D组 晶圆制造可靠性测试 |
| D1 |
Electromigration |
EM |
/ |
/ |
/ |
| D2 |
Time Dependent Dielectric Breakdown |
TDDB |
/ |
/ |
/ |
| D3 |
Hot Carrier Injection |
HCI |
/ |
/ |
/ |
| D4 |
Negative Bias Temperature Instability |
NBTI |
/ |
/ |
/ |
| D5 |
Stress Migration |
SM |
/ |
/ |
/ |
| E组 电学验证测试 |
| E1 |
Pre- and Post-Stress Function/Parameter |
TEST |
所有要求做电学测试的应力试验的全部样品 |
供应商或用户规格 |
| E2 |
Electrostatic Discharge Human Body Model |
HBM |
参考测试规范 |
1 |
AEC-Q100-002 |
| E3 |
Electrostatic Discharge Charged Device Model |
CDM |
参考测试规范 |
1 |
AEC-Q100-011 |
| E4 |
Latch-Up |
LU |
6 |
1 |
AEC-Q100-004 |
| E5 |
Electrical Distributions |
ED |
30 |
3 |
AEC Q100-009 |
| AEC Q003 |
| E6 |
Fault Grading |
FG |
- |
- |
AEC-Q100-007 |
| E7 |
Characterization |
CHAR |
- |
- |
AEC-Q003 |
| E9 |
Electromagnetic Compatibility |
EMC |
1 |
1 |
SAE J1752/3-辐射 |
| E10 |
Short Circuit Characterization |
SC |
10 |
3 |
AEC-Q100-012 |
| E11 |
Soft Error Rate |
SER |
3 |
1 |
JEDEC |
| 无加速：JESD89-1 |
| 加速：JESD89-2或JESD89-3 |
| E12 |
Lead (Pb) Free |
LF |
参考测试规范 |
参考测试规范 |
AEC-Q005 |
| F组 缺陷筛选测试 |
| F1 |
Process Average Testing |
PAT |
/ |
/ |
AEC-Q001 |
| F2 |
Statistical Bin/Yield Analysis |
SBA |
/ |
/ |
AEC-Q002 |
| G组 密封封装完整性测试 |
| G1 |
Mechanical Shock |
MS |
15 |
1 |
JESD22-B104 |
| G2 |
Variable Frequency Vibration |
VFV |
15 |
1 |
JESD22-B103 |
| G3 |
Constant Acceleration |
CA |
15 |
1 |
MIL-STD883 Method 2001 |
| G4 |
Gross/Fine Leak |
GFL |
15 |
1 |
MIL-STD883 Method 1014 |
| G5 |
Package Drop |
DROP |
5 |
1 |
/ |
| G6 |
Lid Torque |
LT |
5 |
1 |
MIL-STD883 Method 2024 |
| G7 |
Die Shear |
DS |
5 |
1 |
MIL-STD883 Method 2019 |
| G8 |
Internal Water Vapor |
IWV |
5 |
1 |
MIL-STD883 Method 1018 |
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